Supermicro’s SuperBlade, Twin and Ultra server families powered by 3rd Generation AMD EPYC™ processors with 3D V-Cache™ technology accelerate critical product design and key technical computing workloads

Supermicro servers provide customers with breakthrough performance, up to 66%* in a variety of specific applications, and modern security features with AMD EPYC processors with AMD 3D V-Cache technology

SAN JOSE, Calif., March 21, 2022 /PRNewswire/ — Super Micro Computer, Inc. (SMCI)world leader in high-performance computing, storage, networking solutions and green computing technology, announces breakthrough performance with the 3dr Gen AMD EPYC processors with AMD 3D V-Cache technology in advanced Supermicro servers. The high density, optimized performance and environmentally friendly SuperBlade® and TwinPro optimized for multiple nodes® and dual-processor Ultra Optimized systems will show significant performance improvement when using the new AMD EPYC 7003 processors with AMD 3D V-Cache for technical computing applications.

Supermicro Systems with AMD EPYC 7003 Series Processors with AMD 3D V-Cache Technology

Supermicro Systems with AMD EPYC 7003 Series Processors with AMD 3D V-Cache Technology

“The Supermicro servers, leveraging new AMD CPUs, will deliver the biggest performance gains our manufacturing customers are looking for to run higher resolution simulations to design better, more optimized products using the latest CAE applications,” said Vik Malyala, President , EMEA, senior vice president, WW FAE, solutions and business. “Our high-performance server platforms will solve more complex problems for engineers and researchers with the new 3rd Generation AMD EPYC processors with AMD 3D V-Cache.”

AMD 3D V-Cache technology is based on the innovative AMD 3D Chiplet architecture and is designed to be the world’s highest performing x86 server processor for technical computing. The L3 cache has been increased to 768 MB, which will allow technical computing applications to keep more data close to the CPUs, giving faster results. Since each core can process more data than previous generations, the total cost of ownership (TCO) will be lower and license costs can be reduced. With servers using AMD EPYC 7003 processors with AMD 3D V-Cache technology, fewer servers may be needed for specific workloads, reducing power consumption and data center management needs. Additionally, all AMD EPYC 7003 processors with AMD 3D V-Cache come with AMD Infinity Guard, a set of next-generation modern security features that help reduce potential attack surfaces as software boots and runs and process critical data.

“We designed the third generation AMD EPYC processors with AMD 3D V-Cache technology to give our customers exactly what they said they needed, higher performance, better energy efficiency and lower total cost of ownership for critical technical computing workloads,” said Ram Peddibhotla, corporate vice president, management of products from EPYC, AMD “With leading architecture, performance and modern security features, the 3rd generation AMD EPYC Processors with AMD 3D V-Cache technology are an excellent choice for complex simulations and rapid product development.”

The SuperBlade has achieved consecutive world records for the 2015 SPECjbb-Distributed Critical-jOPS and max-jOPS benchmark, with up to a 17% improvement using AMD EPYC 7003 processors with AMD 3D V-Cache technology over AMD EPYC 7003 processors without AMD 3D V-Cache technology, which is a significant boost to satisfy performance-hungry business workloads. Based on AMD testing, technical workloads on AMD EPYC 7003 processors with AMD 3D V-Cache technology can show up to a 66%* improvement in a range of specific applications compared to comparable 3rd generation EPYC processors no stacked cache.

The Supermicro SuperBlade with AMD EPYC 7003 processors with AMD 3D V-Cache contains up to 20 CPUs in an 8U chassis, including an integrated in-chassis network switch. Shared power and cooling systems reduce power usage while utilizing the highest performing AMD EPYC family of processors. Maximum memory when full is 40TB in the 8U chassis.

Supermicro’s Twin systems are an industry-leading multi-node platform with up to four servers in a compact 2U rackmount cabinet. The Supermicro TwinPro system has flexible networking and storage options and shared power and cooling systems, reducing electricity consumption with high density. The Supermicro FatTwin® series are multi-node servers designed for high-density environments where a large number of discrete servers and high-capacity storage and interconnects are required in a single chassis.

Supermicro Ultra rack-mount servers are high-performance traditional 1U or 2U servers with two processors that accommodate a wide range of CPUs, I/O options and large amounts of memory and are now available with new AMD processors. EPYC 7003 with AMD 3D V -Cache technology.

About Supermicro

Supermicro (NASDAQ: SMCI) is a world leader in application-optimized total IT solutions. Founded and operating in San Jose, Calif., Supermicro is committed to delivering first-to-market innovation for enterprise IT infrastructure, cloud, AI and 5G Telco/Edge. We are transforming into a total IT solution provider with servers, AI, storage, IoT and switching systems, software and services, while also offering advanced high-volume motherboard, power and chassis products. Products are designed and manufactured in-house (in the USA, TaiwanY The Netherlands), leveraging global operations for scale and efficiency and optimized to improve TCO and reduce environmental impact (Green Computing). The award-winning Server Building Block Solutions® portfolio enables customers to optimize their exact workload and application by selecting from a broad family of systems built from our flexible, reusable building blocks that support a comprehensive set of form factors, processors, memory, GPU, storage, networking, power, and cooling solutions (air conditioning, free-air cooling, or liquid cooling).

Supermicro, Server Building Block Solutions and We Keep IT Green are trademarks and/or registered trademarks of Super Micro Computer, Inc.

AMD, the AMD Arrow logo, EPYC, and combinations thereof are trademarks of Advanced Micro Devices, Inc.

* MLNX-021B: AMD internal testing as of 02/14/2022 on 2x 64C EPYC 7773X compared to 2x 64C EPYC 7763 using the cumulative average of each of the following benchmarks maximum test result scores: ANSYS® Fluent® 2022.1 (maximum is fluent-pump2 82%), ANSYS® CFX® 2022.1 (maximum is cfx_10 61%) and Altair® Radioss® 2021.2 (maximum is rad-neon 56%) plus 1x 16C EPYC 7373X compared to 1x 16C EPYC 75F3 in Synopsys VCS 2020 (maximum is AMD graphics core 66%). Results may vary.

All other brands, names and trademarks are the property of their respective owners.

Source: Super Micro Computer, Inc.

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